Featured Product

Gap Pad 3000S30 is a thermally conductive reinforced, soft S-Class Gap filling material. Click here to learn more.

Products

Rico Products Inc. offers a variety of solution-driven thermal management products for electronic devices.

Thermally Conductive Interface Materials

Bergquist

EMI/RFI shielding

Fishpaper	Formex GK®	Statex®
Vulcanized Fibre	Formex	Nomex®
Nylon	Copaco®	Kapton®
Teflon®	GPO-3	Forbon®
Polycarbonate	Acetal	Peerless®
Lexan®	Bakelite®	Kydex®
Polypropylene	Phenolic	Acrylic
Nylatron®	PVC	Plexiglass®
Ragpaper	Polyethylene	Glastic®
Rag/Mylar	Vinyl	Delrin®
Mylar®	Nylon MDS	Aramid Paper
PTFE	Acetate	Polystyrene
UHMW	Neoprene	ABS
And others…

Thermally
Conductive
Interface Materials
for Cooling
Electronic
Assemblies

Gap Pad® – Thermally Conductive Gap Filling Materials
Sil-Pad® – Thermally Conductive Insulators
Bond-Ply® and Liqui-Bond® – Thermally Conductive Adhesives
Hi-Flow® – Phase Change Interface Materials